PROBLEMS THAT DO NOT FIT ELSEWHERE

THE ABOVE IMAGES SHOW DAMAGE TO PADS CAUSED BY EXCESSING PRESSURE DURING BBT

THE ABOVE IMAGES SHOW WHERE BOARDS HAVE BEEN BADLY OVER ETCHED

THE ABOVE IMAGES SHOW PADS ANT TRACKS THAT ARE INCONSISTANT IN THICKNES AND PADS THAT ARE NOT SMOOTH AND ROUND

THE ABOVE IMAGES SHOW WHERE PADS ARE PARTLY OR COMPLETELY MISSING

THE ABOVE IMAGES SHOW SHORT CIRCUITS ON BOARDS

THE ABOVE IMAGE 1 SHOWS DAMAGE TO THE INNER LAYER COPPER AND IMAGE 2 SHOWS SOME COPPER EXPOSED AT THE EDGE OF THE BOARD

THE ABOVE IMAGE SHOWS THE INNER PLANE LAYERS EXPOSED ON THE BOARD EDGE

THE ABOVE IMAGES SHOW AN OPEN CIRCUIT AND A TRACK GOING NOWHERE

THE ABOVE IMAGE 1 SHOWS WHERE A MANUFACTURER HAS REMOVED A SHORT WITH A SCALPEL AND IMAGE 2 SHOWS A ODDLY DAMAGED TRACK

THE ABOVE IMAGE SHOWS SOMETHING STUCK UNDER THE SOLDER MASK LAYER

Page Maintained By Phil

Last Updated 11th October 2004

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